Wafer Hot Plate Model 8300A for Processing with Vacuum-holding up to 8-inch wafer from room temperature to 300 °C

Key features

• [Free shipping/delivery of 1~2 day express within US mainland, of 3~4 days in AK/HI]
  
• [Free shipping to Canada/Thailand (may pay Duty and Tax)]    

• [No lead time; direct shipping from shelf as available.]
• [Designed, assembled, and tested in USA]

• [For wafer baking processes in semiconductors or MEMS] Includes , hard, and post-exposure baking of photoresist on silicon wafer of 1, 2, 3, 4, 6, 8-inch diameter
• [Vacuum holding wafer on hot plate] Direct thermal contact between wafer and hot plate provides precise real-time temperature control and a shorter baking time of 60 ~ 120 seconds (compared to the typical 30 minutes in an air convection oven)
• [Temperature control] Uniform temperature across entire wafer with a small variability of 0.63 % from ; time-variation of ~ 0.5 °C and reading error = 1 % of full reading
• [Ready for use, as connected to AC power line, upon delivery] Includes an internal vacuum pump for wafer holding, 13 A power cord, SS cap screws, and quick start guide
• [Updated from Model 300A] Upgraded from the previous Model 300A with better thermal design of 2 larger cooling fans (bottom and rear sides) and 4 radiation shields.  Model 300A is discontinued.

Description

• This hot plate is specifically meant for semiconductor wafer processes, in R&D or pilot stages. Photoresists layers are coated and baked before optical patterning. For wafer baking, solvents are evaporated and the polymer layer gets chemical links and hardened mechanically. This hot plate model covers a wide range of temperatures (room temperature ~ 300 °C on the silicon wafer).
• To ensure uniform heating of whole wafer, the surface temperature is measured at 9 different spots across 8-inch wafer with surface thermometer on silicon wafer.

• This device has an internal vacuum pump with low noise. Expected life time is > 5000 hours with continuous operation. Since the device uses a brushless motor, frequent turning on/off of the motor does not reduce the lifetime. Additionally, a 1/4 inch Outer Diameter of tube connector is available for using the external vacuum line (if preferred). The internal/external vacuum lines can be selected by a toggle switch on the front side.

• To accommodate wafers of different sizes, Stainless Steel (SS) cap screws can be screwed into vacuum-ring holes on the heating plate. To permit proper vacuum-holding of wafers, all holes not covered by the wafers need to be sealed by screws. This device handles wafers with a diameter of 1, 2, 3, 4, 6, and 8-inches.
• The 2 SS cap screws can be installed into the 2 holes just located on the outside of the loaded wafer-edge to safely load the wafer with tweezers (hold one side of the wafer with tweezers while loading the wafer on the plate).

• We test every device before packing and shipping. The device remains fully functional even with the presence of small cosmetic imperfection spots (for example, minor touches on the top surface).
• The top surface may gradually become discolored (white to grey) without functional degradation, if constantly used at higher temperatures.

Technical Notes

• Wafer surface temperature is measured at 9-points over whole silicon wafer.
• Thermal uniformity CV (sigma/mean) is better than 0.63 % over whole wafer.
• Temperature fluctuation is slow over > 10 min and smaller than 0.5 % of Set Value (SV) temperature.

• The controller has Auto-Tuning (AT) function of PID (Proportional/Integral/Differential) control.
• One may need AT after the initial installation and/or different environment, for the more stable and tight control.
• Each hot plate has factory setting for PID control, which is good in most cases and a starting point for AT in case.
• This model is for the fixed temperature operation.

Safety features

• Alarm buzzer (90 decibels, continuous) is on the front side. By default, the alarm is triggered if the plate's temperature (PV on the controller’s display) is > 320 °C. Alarm settings can be modified on the controller.

• By default, the controller box will turn off the plate-heating power line when the temperature of the controller box becomes higher than 50 °C. The thermostat will auto-reset once the plate is air-cooled down to 30 °C.

• Safety fuses in place for the main power line, vacuum pump, and Solid State Relay.

Specifications

Physical dimension
Whole body (L x W x H): 11 inches x 11 inches x 7.5 inches (279.4 x 279.4 x 192 mm).
Heating plate dimension (L x W): 9 inches x 9 inches (228.6 x 228.6 mm).
Weight: 11.5 Pounds (5.2 Kg).

Utility requirements
100 - 120 V with 13 A with an outlet of NEMA 5-15P (US standard 3-plugs).
Heating power: ~ 1200 Watts at 120 V

External Vacuum line:
10-inch Hg base vacuum and >= 5 liter/min flow rate at 0-inch Hg
Push-to-Connect connector adapts (1/4-inch) Outer Diameter plastic tube of vacuum line.

Environmental Conditions
Operating Conditions:
Indoor use only.
Temperature: 5 to 40°C (41 to 104°F)
Humidity: 20% to 80% relative humidity,
Altitude: 0 to 6,562 ft. (2000 m) above sea level

Non-Operating Storage:
Temperature: -20 to 65°C (-4 to 149°F)
Humidity: 20% to 80% relative humidity

Package contents

• 1 piece, Wafer Hot Plate Model 8300A
• 1 piece, Power cord (8 feet, 13 A, 16 AWG NEMA 5-15P to IEC-320-C13
• 1 bag, cleaned #2-56-1/4” SS socket cap screws (8 pcs)
• 1 piece, quick start manual (2-page laminated)
• 1 hard copy of the manual
• 1 USB memory stick (electronic copy of full manual and quick start manual)

** Note: All SS (stainless Steel) screws are alcohol-cleaned and sealed in plastic bags.

** Please click the below links for details.

Detail Description          Specifications          Technical Notes

Safety Features              Package Contents