- This hot plate is specifically meant for semiconductor wafer processes, in R&D or pilot stages. Photoresists layers are coated and baked before optical patterning. For wafer baking, solvents are evaporated and the polymer layer gets chemical links and hardened mechanically. This hot plate model covers a wide range of temperatures (room temperature ~ 300 °C on the silicon wafer).
- To ensure uniform heating of whole wafer, the surface temperature is measured at 9 different spots across 8-inch wafer with surface thermometer on silicon wafer.
- This device has an internal vacuum pump with low noise. Expected life time is > 5000 hours with continuous operation. Since the device uses a brushless motor, frequent turning on/off of the motor does not reduce the lifetime. Additionally, a 1/4 inch Outer Diameter of tube connector is available for using the external vacuum line (if preferred). The internal/external vacuum lines can be selected by a toggle switch on the front side.
- To accommodate wafers of different sizes, Stainless Steel (SS) cap screws can be screwed into vacuum-ring holes on the heating plate. To permit proper vacuum-holding of wafers, all holes not covered by the wafers need to be sealed by screws. This device handles wafers with a diameter of 1, 2, 3, 4, 6, and 8-inches.
- The 2 SS cap screws can be installed into the 2 holes just located on the outside of the loaded wafer-edge to safely load the wafer with tweezers (hold one side of the wafer with tweezers while loading the wafer on the plate).
- We test every device before packing and shipping. The device remains fully functional even with the presence of small cosmetic imperfection spots (for example, minor touches on the top surface).
- The top surface may gradually become discolored (white to grey) without functional degradation, if constantly used at higher temperatures.
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