Wafer Hot Plates

Key features

  • [For wafer baking processes in semiconductors or MEMS] Includes , hard, and post-exposure baking of photoresist on silicon wafer of 1, 2, 3, 4, 6, 8-inch diameter
  • [Vacuum holding wafer on hot plate] Direct thermal contact between wafer and hot plate provides precise real-time temperature control and a shorter baking time of 60 ~ 120 seconds (compared to the typical 30 minutes in an air convection oven)
  • [Temperature control] Uniform temperature across entire wafer with a small variability of 0.63 % from ; time-variation of ~ 0.5 °C and reading error = 1 % of full reading
  • [Ready for use, as connected to AC power line, upon delivery] Includes an internal vacuum pump for wafer holding, 13 A power cord, SS cap screws, and quick start guide
  • [Free 1~2 day delivery within US mainland]
  • [Designed, assembled, and tested in USA]
1 product
  • $3,684.98 USD
    $3,684.98 USD
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